接口丰硕，可选配GMSL/POE/DIO职能扩大板, 支持4G/5G/WiFi
接口隔离设计，加强了通讯抗滋扰能力
超低温启动（带自动加热？椋
宽温设计，支持-40~70℃工作温度
| Items | Description |
| Processor Module | Nvidia Jetson Orin NX 16G, AI Performance: 156TOPS INT8 |
| CPU | 8-core Arm® Cortex®-A78AE v 8.2 64-bit 2.0Ghz CPU 2MB L2 + 4MB L3 |
| GPU | NVIDIA Ampere architecture with 1024 NVIDIA® CUDA® cores and 32 Tensor Cores |
| Memory | 16GB 256-bit LPDDR5 102 GB/s |
| Storage | M.2 2280, PCIe Gen4, 256G/512G/1T/2T SSD |
| 2.5" SATA Driver Bay x 1 | |
| OS Support | NVIDIA JetPack 6.2 |
| Display | HDMI 2.0, support 1080P@60Hz |
| I/O Configuration | 2x 1GbE （100/1000M BASE-T) |
| 2x USB3.0 Type-A, 1x USB2.0 Type-C (for firmware update) | |
| 4x GMSL2 (Optional) | |
| 4x 1GbE POE (Optional, 802.3 at，4xGMSL & 4x POE 只能同时扩大其中一种？) | |
| 3x DB9 ( 1x CAN FD, 2x RS232/422/485) | |
| 8x DIO (optional, 4x DI, 4x DO) | |
| RF | 1x NVMe M.2 slot for WiFi-5/6/7 module |
| 1x NVMe M.2 slot for 4G/5G Module | |
| Dimensions | Device Physical dimension: 240x154x84(mm) Mainboard Physical dimension: 184x150x25(mm) |